The AKT-PiVot 55KV PVD system has a vertical platform for sputtering deposition of metal and pixel ITO materials on glass substrate sizes above Gen. 8 for TFT-LCD manufacturing. This system is deigned to enable customers to further reduce COO (Cost of Ownership) of LCD panel manufacturing.

The AKT-PiVot system’s module architecture delivers significantly faster cycle time and enables a large variety of configurations to maximize production efficiency. Unlike traditional in-line systems, the AKT-PiVot’s parallel processing capability eliminates bottlenecks caused by different process times for each film layer. The system’s cluster-like arrangement also allows continuous operation during individual module maintenance.

The proprietary rotary cathode technology enables nearly 3x higher target utilization than any competitive system. Each deposition module of the PiVot system features an array of large-volume, rotary targets that have >4x longer lifetime than conventional planar targets. The PiVot system’s deposition modules feature an innovative pre-sputter unit that enables target conditioning using only one substrate, rather than up to 50 substrates that are needed with other systems to achieve the same results.

Attributes as high throughput, excellent layer properties and better uptime enable customers to produce higher quality panels at lower cost of ownership.