The Applied Endura2 is the industry-leading 300mm metallization platform delivering world-class productivity and reliability performance for the full range of metal deposition applications, including aluminum, copper barrier/seed, liner/barrier, advanced silicide, and UBM/bondpad. With solutions extendible to ≤45nm generations, the system architecture allows flexible configurations with PVD (Physical Vapor Deposition), CVD (Chemical Vapor Deposition), and ALD (Atomic Layer Deposition) technologies.

Applied Materials’ optimized particle performance package, Opera, enables outstanding particle performance on the Endura2 mainframe, delivering repeatable single-digit defect levels for high and consistent product yield. The Endura2 ensures precision wafer handling using the integrated Local Center Finder and motorized lifts at each chamber. For easy serviceability, the platform offers features such as full access beneath the mainframe and chambers to enable higher uptime. Its modular design allows customers to use the same Endura toolset for multiple device generations with easy field upgrades.