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Real-time Profile Control for Improved Copper CMP, Solid State Technology, June 2003 (212KB)
The Development of a Direct-Polish Process for STI CMP, May 2003 (322KB)
Hybrid CMP Process for Copper and Ultra Low-k Materials Integration, 2003 (65KB)
Slurryless Fixed-Abrasive Web for Direct Polish STI CMPs, SEMICON Korea, 2003 (80KB)
Chemical Mechanical Polishing of Copper-CVD Low k Films: A Comparison of Selective and Non-Selective Processes, VMIC, November 2001 (223KB)
Chemical Mechanical Polishing of Copper-Porous Low k Films: Single Damascene Scheme and Related Issues, VMIC, November 2001 (264KB)
A Low Cost and Residue-Free Abrasive-Free Copper CMP Process with Low Dishing, Erosion and Oxide Loss, IITC, November 2001 (863KB)
Development of a Direct Polish Process for Shallow Trench Isolation Modules, CMP-MIC, March 2001 (66KB)
Ultra-Low Slurry Use for Oxide Chemical Mechanical Planarization (CMP) Process, CMP-MIC, March 2001 (36KB)
Advanced 300mm Oxide CMP Solution, SEMI Education, February 2001 (809KB)
Unlocking Copper Damascene Puzzle, SEMICON West, July 2000 (42KB)
New Pad Conditioning Disk Design Delivers Excellent Process Performance While Increasing CMP Productivity, SEMICON West, July 2000 (89KB)
Defectivity Reduction in Copper CMP Processes, VMIC, June 2000 (246KB)
Removal Rate, Uniformity and Defectivity Studies of Chemical Mechanical Polishing of BPSG Films, CMP-MIC, March 2000 (34KB)
STI CMP Using Fixed Abrasive Demands, Measurement Methods and Results, CMP-MIC, March 2000 (517KB)
Advanced Front End CMP and Integration Solutions, CMP-MIC, March 2000 (246KB)
Novel Integrated Single-Wafer Immersion Megasonics for Advanced Post CMP Cleaning in a Next Generation Dry-in Dry-out CMP System, CMP-MIC, March 2000 (843KB)
Pad Life Optimization by Characterization of a Fundamental Pad-Disk Interaction Property, CMP-MIC, March 2000 (119KB)
Process Control and Endpoint Detection with Fullscan ISRM System in Chemical Mechanical Polishing of Cu layers, CMP-MIC, March 2000 (78KB)
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