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Conductor Deposition Technical Articles/Papers Archive
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65nm Cu Barrier/Seed Solutions, SEMICON West 2003 Technical Seminar, July 2003 (3.01MB)
Replacement Metal-Gate NMOSFETs with ALD TaN/EP-Cu, PVD Ta and PVD TaN Electrode, Electron Device Letters (EDL), May 2003 (100KB)
Endura XP: Enabling High Productivity and Reliability for 300mm Semiconductor Manufacturing Excellence, Advanced Semiconductor Manufacturing Conference, April 2003 (537KB)
Endura XP: Enabling High Productivity and Reliability for 300mm Semiconductor Manufacturing Excellence, Advanced Semiconductor Manufacturing Conference, Poster, April 2003 (472KB)
Making a Better Copper Barrier, Semiconductor International, March 2003†
Advanced Engineering of PVD and ALD Based Barriers fro Sub-micron Device Generations in Dual Damascene Copper Interconnects, SEMI Symposium (SEMICON China 2003), March 2003 (958KB)




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