The Applied Centura eMAX Etch leverages the company's extensive experience in medium-density plasma etch technology in a flexible and cost-effective etcher for a broad portfolio of dielectric applications.  Well-established in logic, memory, and foundry fabs worldwide, eMAX provides this extensive installed base with extendibility of a proven chamber.

For next generation applications, optional hardware refinements (dual-zone gas feed, multiple RF frequencies, and enhanced pumping capability) produce higher etch rates, improved uniformity, and tighter profile control while eliminating wafer-edge effects.  To balance selectivity versus etch capability, especially for high aspect ratio etch, eMAX operates in a low pressure/high gas flow regime complemented by process chemistries specifically tailored to optimize resist and baselayer selectivities.

Rapid wafer handling, high etch rates, and four-chamber capabilities translate into high productivity.  Effective polymer deposition management through temperature controls and plasma confinement facilitates extended production runs.  Longer mean time between cleans (>150 RF hours), high system throughput, 90%+ up time, and low consumables costs combine to create a production-proven, reliable, cost-effective etch system.