The Applied Oasis Clean is a 300mm single-wafer system designed for critical, front end of the line pre-thermal and post-strip wet cleans for sub-130nm devices. The Oasis uses two innovative breakthroughs that result in better process results. MegaClean, a full-coverage megasonics unit, enables highly efficient particle removal from both sides of the wafer. The system also uses a single-step chemistry called the AM-clean that condenses the traditional two-step RCA (SC1-SC2) process. These advancements result in improved process performance and productivity over traditional wet bench designs, along with enhanced product yield and reduced production cycle-time.