The Applied Producer Etch, with its patented Twin Chamber design, answers today's demands for a reliable, cost-effective production tool for conventional dielectric etch applications at 90nm and below.  Modeled on the production-proven Producer SE platform, the highly compact etcher can be configured with up to three Twin Chambers for maximum output.

Producer Etch offers dual-chamber productivity while maintaining single-chamber performance and process control.  Each Twin Chamber can operate in single- or dual-wafer mode.  Etch rate, etch rate uniformity, and resist selectivity can be tuned by adjusting the gap between the electrodes, enabling process optimization for different applications.  This feature makes it possible for a fab to simultaneously run different applications on the same system. Paired processing and a two-FOUP, dual robot factory interface produce up to 40% higher throughput than single-wafer cluster systems.

Efficient plasma confinement, in-situ cleaning, and high-purity plasma-resistant chamber materials produce quality performance and a mean time between wet cleans of at least 200 RF hours in a volume production environment.  Producer delivers the highest throughput among commercially available etchers at a low cost of ownership.