Applied Reflexion LK CMP provides production-proven, high performance planarization solutions for copper damascene, shallow trench isolation (STI), oxide, polysilicon, and tungsten applications. Its high-speed planarizing platens and multi-zone polishing heads enable superior uniformity and efficiency with low downforce for extendibility to <45nm device generations. The integrated post-CMP Desica cleaner uses unique full-immersion Marangoni vapor drying technology to virtually eliminate watermark defects and dramatically reduce particle contamination.

The Applied Reflexion LK CMP system also implements a full suite of endpoint methods, in-line metrology and advanced process control capabilities that ensure excellent within-wafer and wafer-to-wafer process control and repeatability for all planarization applications. Its patented window-in-pad technology enables accurate real-time polish control of every wafer without compromising throughput. The new FullVision in-situ endpoint system, for all stop-in and stop-on dielectric applications, uses broadband spectroscopy to significantly improve Cpk and minimize wafer scrap caused by drifts in consumable sets and incoming wafer variations.