Leading the SEM review market since 1998, the SEMVision G3 STAR family is a set of leading-edge tools optimized for different applications, enabling flexible system utilization during all stages of production ramp at the lowest overall cost. All three systems in the SEMVision family – G3 STAR, G3 HP STAR and G3 FIB STAR – share a single platform, a common user interface and shared recipes. This unique commonality shortens set-up time through extensive recipe sharing, and provides higher availability and WIP control. Using a common platform also lowers operating expenses by sharing spares, service contracts and operating knowledge.

In addition to 65nm (production) / 45nm (development) sensitivity and high throughput, the Applied SEMVision G3 STAR systems feature the Quantified Process Monitoring (QPM) solution which combines high resolution SEM imaging and tailored algorithms to automatically detect and monitor systematic defects. QPM allows monitoring of all wafers with significantly more statistical data, leading to more reliable process information to guide process development and production operation. Taking defect review beyond the traditional patterned area of the wafer, the Applied SEMVision G3 STAR systems also support Wafer Edge Review - a unique application for monitoring and defect review on the wafer's edge.

The STAR enhancement over the original SEMVision G3 offers better imaging resolution, higher throughput and adaptive imaging - online switching of probe current for optimization of SEM parameters for optimal image quality at highest possible throughput. It is available also as a field upgrade on all SEMVision G2 and G3 models.

Applied SEMVision G3 STAR Defect Analysis 
Applied SEMVision G3 STAR Defect Analysis is the production-proven system for inline defect review and analysis for the 65nm era. Continuing the productivity leadership of the SEMVision product line, G3 STAR delivers high throughput and extreme sensitivity, offering the most advanced capabilities for production and engineering applications.

Field proven applications such as High Aspect Ratio imaging, tilt imaging and EDX-based material analysis provide customers the ability to control defects and processes with greater success, leading to higher yields and faster time to market.

Applied SEMVision G3 HP STAR Defect Analysis
With throughput up to 1,800 defects per hour and sensitivity down to 30nm, Applied SEMVision G3 HP STAR high productivity system sets industry benchmark for productivity and cost of ownership. As part of the SEMVision G3 STAR family, it enjoys seamless recipe sharing with the other tools.

Applied SEMVision G3 FIB STAR Defect Analysis
With a focused ion beam (FIB) integrated into the SEM review system, Applied SEMVision G3 FIB STAR Defect Analysis is the tool of choice for inline root cause analysis. Immediately available after SEM review, the integrated FIB performs local cross section of defects, providing inline defect root cause identification and real-time corrective action.

At the heart of the Applied SEMVision G3 STAR FIB system is the patented ClearCut technology. It enables shorter working distances under both the SEM and FIB columns, as well as a variety of advanced imaging technologies including MPSI (Multiple Perspective SEM Imaging), voltage contrast and high aspect ratio imaging, and material analysis by EDX (Energy-Dispersive X-ray).

Taking a leap in image resolution with the STAR enhancement, closing the defect characterization loop with SEMVision G3 FIB STAR is a major step forward in overall production efficiency and defect resolution.

The SEMVision G3 STAR family is part of Applied Materials' Resolution strategy to lead the metrology and inspection market with continuous advances in absolute resolution, root cause, process response and cost per resolution.